Smart 3D Inspection for Semiconductor | LMI Technologies

Wafer Inspection (Dimensioning, Sorting, Defect Detection)

After laser dicing and/or scribing is complete, Gocator® 3D Line Confocal Sensors are used to measure the accuracy of the groove placement, groove depth, and kerf width of the wafer scribing to prevent defects such as die chipping. This allows for more usable die per wafer, and ensures maximum quality and processing speeds for the highest production throughput.

Wafer Sorting

The industry’s first smart 3D line confocal sensors

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Generates Three Data Types

Gocator® line confocal sensors generate 3D topography (for 3D surface geometry), 3D tomography (for multi-layer 3D geometry), and 2D intensity data simultaneously, allowing these sensors to handle virtually any material type including multi-layered, transparent, curved, mixed material, and more.

Gocator® 3D Line Confocal Sensors are used to scan and inspect wafer size, thickness, and flatness, in addition to providing high-precision defect detection of die chips and other surface imperfections.

Gocator® 5500

Fast Scan Rates

Gocator® 5500 sensors feature a custom high-speed imager and high-performance electronics to deliver metrology-grade inspection at over 10 kHz with PC acceleration.

BGA/PGA Inspection (Position, Height, Radius)

Gocator 3D line confocal sensors are used for inspection of BGA and PGA position, height, and radius during assembly and test IC.

The industry’s first smart 3D line confocal sensors

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Gocator® 5500 Series

BGA (Ball Grid Array) Inspection

Gocator® 3D Line Confocal Sensors can accurately measure ball height, ball position, and other dimensional information of the ball with a diameter of less than 50µm.

PGA (Pin Grid Array) Inspection

Gocator® 3D Line Confocal Sensors can accurately inspect the height and position of the PGA pins to ensure that there are no poor contacts created during the subsequent insertion and removal process, and to prevent defects such as pin damage caused by positional errors.

Solder Joint Inspection

Gocator® 3D Line Confocal Sensors can accurately measure and inspect the flatness and height of joint position before welding, and minimize the breakage of each solder joint after subsequent welding is completed.

Silver Epoxy Inspection (Dye Process)

Gocator® 3D Line Confocal Sensors are used to accurately measure the surface area of coated silver epoxy in each lead frame area, as well as the height (i.e. thickness) of the epoxy glue bead.

Built-in Measurement Tools

Onboard tools allow users to take area and volume measurements without having to invest in 3rd party vision software or develop custom tool sets on their own.

Gocator® 5500 series

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Scans Any Material Type

3D imaging is contrast-invariant and can therefore be used to scan a range of adhesive material types from opaque to translucent and transparent. In comparison, 2D solutions cannot provide shape measurements because they only generate contrast-based data.

The industry’s first smart 3D line confocal sensors

3D Shape Data

Gocator sensors generate the essential 3D shape data required for precision volumetric measurement and shape-based defect detection (e.g. bubbles, thickness) on the glue bead.

Wire Bonding Defect Detection

Gocator® 3D Line Confocal Sensors are used for high accuracy measurement of the arch-height and position of the wire (gold, copper, or aluminum).

Web-Based User Interface

Features such as the web-browser driven point-and-click environment for rapid configuration, built-in measurement tools and rich I/O for communicating results make it easy for factory technicians to get the results they need.

Gocator line confocal sensors provide excellent performance on highly reflective, mirror-like, transparent, and multilayered surfaces.

High Performance on Challenging Surfaces

Defect Detection

Gocator line confocal sensors also detect defects in the wire itself, such as breaks or bends.

Gocator® 5500 series

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The industry’s first smart 3D line confocal sensors

Ball-Bumping Dimensional Measurement

Gocator® 3D Line Confocal Sensors accurately capture the diameter and height (thickness) of the ball down to 2.5 microns.

Gocator® 5500

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Gocator line confocal sensors are also used to inspect the coplanarity between all ball bumps––detecting any height variation that can cause uneven distribution of force, die fractures, and open circuits.

Coplanarity Measurement

The industry’s first smart 3D line confocal sensors

High-Density Data Generation

Gocator® line confocal sensors generate up to 28 million 3D and 2D data points per second per surface.

High Resolution and Repeatability

Gocator line confocal sensors achieve X resolutions up to to 2.1 µm (X) and Z-repeatability up to 0.05 µm for highly precise and accurate measurements.

Final Packaging Measurement and Inspection

Gocator® 3D Line Confocal Sensors can capture the length, width, and height of the chip after final packaging.

Gocator® 5500 series

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These sensors can also output high-resolution 2D grayscale images to detect defects such as pits and scratches.

2D Intensity Output

The industry’s first smart 3D line confocal sensors

FactorySmart® Sensors

Gocator 3D smart sensors connect seamlessly with networks to communicate results, display diagnostics and statistics over web browsers, access upgrades over the Internet, and interface with factory equipment.

3D Smart Sensors for Semiconductor Manufacturing Inspection

Semiconductor fabrication is a multi-step manufacturing sequence made up of mechanical, photolithographic, and chemical processing steps, during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are chosen for specialized applications.

Gocator® 3D Line Confocal Sensors deliver precision inline 3D scanning and inspection at various stages of this fabrication process for maximum product quality and optimal production throughput.

The Gocator 4000 Series introduces coaxial line confocal sensor technology to complement LMI’s existing Line Confocal product portfolio. These sensors provide high-speed, high-resolution, versatile and shadow-free 3D inline inspection performance with outstanding angular range (Max Slope Angle up to +/- 85 degrees) for manufacturing applications in Semiconductor, Consumer Electronics, EV Battery, and many more.

5500 Series

Recommended Solution

The Gocator® 5500 series adds patented line confocal imaging (LCI) technology to the Gocator® family of 3D smart sensors. These line confocal sensors deliver high speed, wide coverage 2K line scanning with simultaneous generation of 3D topography, 3D tomography, and 2D intensity data.

This allows Gocator® 5500s to scan practically any material type––including multi-layered, transparent/translucent, curved edge, shiny/specular, high-contrast textured, mixed, and many more––with submicron precision, and at a level of quality and speed that outperforms competing confocal technologies.

2500 Series

Recommended Solution

Gocator 2500 3D smart sensors are the fastest, most compact, and advanced Gocator laser line profilers to date. Designed for high performance small parts inspection, these

line profilers achieve inspection rates up to 10 kHz (including scan, measure, and control) and high X resolutions down to 8 microns. A custom 2MP high speed imager, optimized optical design, and blue laser light generate excellent data with highly repeatable results on shiny and other challenging surfaces.

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LMI Technologies designs and delivers cutting-edge smart 3D technologies for the factory. Trusted in industries from automotive and consumer electronics to rubber & tire, road & rail, and wood, our 3D solutions improve production through inspection, automation, and optimization of your products and processes.

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